Twaħħil li jwaħħal SMT
May 27, 2025
Electrically conductive adhesives (Ag-epoxy) replace solder in flexible circuits. Dispensing accuracy: 0.1mm dot size. Cure parameters: UV (5s) or thermal (150°C/30min). Applications: MEMS, display bonding. Shear strength >25MPA għal kull ASTM D 1002. Sfidi: Stabbiltà tal-Konduttività fit-Tul taħt Umdità .
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Li jmiss: Prattiki SMT sostenibbli
